Xilinx, Inc. : Xilinx Returns to DAC Asking - Why ASIC When You Can Go All Programmable? - 4-traders (press release)
24 May 2012, 6:04 am
and allow new levels of programmable interconnect within monolithic devices and multi-die 3D ICs. The Vivado Design Suite was developed from the ground up to enable the next decade of design with these All Programmable devices, and to create a powerful ...

Xilinx Kintex-7 FPGA Embedded Kit Accelerates Productivity and Programmable System Integration for FPGA-Based Soft Processor Systems - Marketwatch
24 May 2012, 5:00 am
and allow new levels of programmable interconnect in both monolithic and multi-die 3D ICs. The company's products are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to ...

Xilinx Returns to DAC Asking - Why ASIC When You Can Go All Programmable? - Marketwatch
23 May 2012, 11:42 am
and allow new levels of programmable interconnect within monolithic devices and multi-die 3D ICs. The Vivado Design Suite was developed from the ground up to enable the next decade of design with these All Programmable devices, and to create a ...

UBM & Xilinx Launch All Programmable Planet - TMCnet
23 May 2012, 8:00 am
At the same time, these devices are now combining all forms of programmable technologies to meet growing application mandates; going beyond hardware to software programmability, beyond digital to analog, and beyond single to multi-die 3D ICs ...

SoC Power Design Software supports sub-20 nm process technology. - ThomasNet Industrial News Room
22 May 2012, 7:25 am
It is also architected to support the simulation of emerging chip and packaging technologies using multidie three-dimensional ICs (3D-ICs) for smart electronic products. "For more than a decade, RedHawk has been the industry standard for solving critical ...

Xilinx, Inc. : UBM & Xilinx Launch All Programmable Planet - Helping Developers Change the World Using Programmable Devices - 4-traders (press release)
21 May 2012, 6:54 pm
At the same time, these devices are now combining all forms of programmable technologies to meet growing application mandates; going beyond hardware to software programmability, beyond digital to analog, and beyond single to multi-die 3D ICs," said Steve ...

Solid State NAND Memory meets needs of enterprise storage. - ThomasNet Industrial News Room
17 May 2012, 7:24 am
Designed to maximize data transfer rates, Flash-based, solid state devices can be configured into multi-die, single packages supporting high densities. (Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

RedHawk-3DX: Dynamic Power Sign-Off - Embedded.com
15 May 2012, 6:18 pm
With its hierarchical dynamic simulation capabilities, new logic and activity propagation engines, the ability to model and simulate LDOs, direct support for multi-die simulation, and a brand new multi-pane, multi-canvas GUI, RedHawk-3DX will ...

Apache Design unveils new RedHawk-3DX solution - ElectroIQ
13 May 2012, 7:32 pm
It is also architected to support the simulation of emerging chip and packaging technologies using multidie three-dimensional ICs (3D-ICs) for smart electronic products. "For more than a decade, RedHawk has been the industry standard for solving ...

Apache Design Releases Fourth-Generation RedHawk for Sub-20 Nanometer Power Sign-off - Boston Globe
1 May 2012, 6:24 am
It is also architected to support the simulation of emerging chip and packaging technologies using multidie three-dimensional ICs (3D-ICs) for smart electronic products. "For more than a decade, RedHawk has been the industry standard for solving ...